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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/03/2018
Application #:
14479518
Filing Dt:
09/08/2014
Publication #:
Pub Dt:
03/10/2016
Inventors:
Johannes Georg Laven, Matteo Dainese, Hans-Joachim Schulze
Title:
Method of Forming a Semiconductor Substrate With Buried Cavities and Dielectric Support Structures
Assignment: 1
Reel/Frame:
034164/0974Recorded: 11/13/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/10/2014
Exec Dt:
09/10/2014
Exec Dt:
09/10/2014
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
8000 REGENCY PARKWAY, SUITE 415
CARY, NC 27518

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