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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9935261
Issue Dt:
04/03/2018
Application #:
15479522
Filing Dt:
04/05/2017
Inventors:
Ru-Ying Tong, Sahil Patel, Dongna Shen, Vignesh Sundar, Yu-Jen Wang
Title:
Dielectric Encapsulation Layer for Magnetic Tunnel Junction (MTJ) Devices Using Radio Frequency (RF) Sputtering
Assignment: 1
Reel/Frame:
042139/0832Recorded: 04/25/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PATEL, SAHIL
Exec Dt:
03/22/2017
TONG, RU-YING
Exec Dt:
03/22/2017
SHEN, DONGNA
Exec Dt:
03/22/2017
WANG, YU-JEN
Exec Dt:
03/22/2017
SUNDAR, VINGNESH
Exec Dt:
03/22/2017
Assignee:
HEADWAY TECHNOLOGIES, INC.
678 SOUTH HILLVIEW DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
SAILE ACKERMAN LLC
28 DAVIS AVENUE
POUGHKEEPSIE, NY 12603
Assignment: 2
Reel/Frame:
048692/0917Recorded: 03/25/2019Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HEADWAY TECHNOLOGIES, INC.
Exec Dt:
02/04/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN ROAD 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE, SUITE 4000
IP SECTION
DALLAS, TX 75219

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