Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/10/2018
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Application #:
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15489584
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Filing Dt:
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04/17/2017
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Publication #:
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Pub Dt:
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10/19/2017
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Inventors:
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Liping Zhang, Mikhail Baklanov
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Title:
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METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A METALLIZATION LAYER COMPRISING LOW K DIELECTRIC MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| K.U. LEUVEN R&D, WAAISTRAAT 6 - BOX 5105 |
| LEUVEN, BELGIUM 3000 |
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| KNOBBE, MARTENS, OLSON & BEAR, LLP |
| 2040 MAIN STREET |
| 14TH FLOOR |
| IRVINE, CA 92614 |
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