Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/01/2018
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Application #:
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14830820
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Filing Dt:
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08/20/2015
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Publication #:
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Pub Dt:
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12/10/2015
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Inventors:
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Ping-Yin LIU, Szu-Ying CHEN, Chen-Jong WANG, Chih-Hui HUANG, Lan-Lin CHAO et al
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Title:
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HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN & HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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