Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/01/2018
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Application #:
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14576105
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Filing Dt:
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12/18/2014
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Publication #:
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Pub Dt:
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04/16/2015
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Inventors:
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Yasuko IMANISHI, Takahiro FUKUNAGA
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Title:
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LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| PASONA KNOWLEDGE PARTNER INC. |
| 1-61, SHIROMI 2-CHOME, CHUO-KU |
| 8F OBP PANASONIC TOWER |
| OSAKA, 540-6208 JAPAN |
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