Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/01/2018
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Application #:
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15306987
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Filing Dt:
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10/26/2016
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Publication #:
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Pub Dt:
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02/09/2017
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Inventors:
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Hua SHI, Wei JIA
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Title:
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LOUDSPEAKER MODULE APPLIED INSIDE TERMINAL
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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#268 DONGFANG ROAD, HI-TECH INDUSTRY DISTRICT, SHANDONG |
WEIFANG, CHINA 261031 |
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AMPACC LAW GROUP, PLLC |
6100 219TH ST. SW |
SUITE 580 |
MOUNTLAKE TERRACE, WA 98043 |
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