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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/15/2018
Application #:
15416206
Filing Dt:
01/26/2017
Publication #:
Pub Dt:
05/11/2017
Inventors:
Adam M. Kennedy, Buu Q. Diep, Thomas Allan Kocian, Mark Lamb
Title:
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
Assignment: 1
Reel/Frame:
041092/0958Recorded: 01/26/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/11/2015
Exec Dt:
06/23/2015
Exec Dt:
06/16/2015
Exec Dt:
06/23/2015
Assignee:
870 WINTER STREET
WALTHAM, MASSACHUSETTS 02451-1449
Correspondent:
CANTOR COLBURN LLP - RAYTHEON
20 CHURCH STREET
22ND FLOOR
HARTFORD, CT 06103

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