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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9972504
Issue Dt:
05/15/2018
Application #:
14830683
Filing Dt:
08/19/2015
Publication #:
20170040214
Pub Dt:
02/09/2017
Inventors:
Keren Jacobs Kanarik, Anand Chandrashekar, Wenbing Yang, Michal Danek et al
Title:
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
Assignment: 1
Reel/Frame:
036731/0266Recorded: 10/05/2015Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LAI, CHIUKIN STEVEN
Exec Dt:
09/02/2015
KANARIK, KEREN JACOBS
Exec Dt:
09/03/2015
TAN, SAMANTHA
Exec Dt:
09/02/2015
CHANDRASHEKAR, ANAND
Exec Dt:
09/02/2015
SU, TEH-TIEN
Exec Dt:
09/17/2015
YANG, WENBING
Exec Dt:
09/02/2015
DANEK, MICHAL
Exec Dt:
09/02/2015
Assignee:
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
WEAVER AUSTIN VILLENEUVE & SAMPSON LLP
P.O. BOX 70250
OAKLAND, CA 94612
Assignment: 2
Reel/Frame:
036814/0871Recorded: 10/16/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
WOOD, MICHAEL
Exec Dt:
10/14/2015
Assignee:
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
WEAVER AUSTIN VILLENEUVE & SAMPSON LLP
P.O. BOX 70250
OAKLAND, CA 94612

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