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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/15/2018
Application #:
15596938
Filing Dt:
05/16/2017
Publication #:
Pub Dt:
11/30/2017
Inventors:
Franco Mariani, Markus Brunnbauer
Title:
Method of Separating Semiconductor Dies from a Semiconductor Substrate, Semiconductor Substrate Assembly and Semiconductor Die Assembly
Assignment: 1
Reel/Frame:
042400/0355Recorded: 05/16/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/05/2017
Exec Dt:
05/02/2017
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252

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