Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/05/2018
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Application #:
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14933694
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Filing Dt:
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11/05/2015
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Publication #:
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Pub Dt:
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05/12/2016
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Inventors:
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John Spann, Damien Lambert, Stephen Krasulick
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Title:
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SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN IMPLANTATION FOR TRANSFER-WAFER REMOVAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5600 EUBANK BOULEVARD NE |
| SUITE 200 |
| ALBUQUERQUE, NEW MEXICO 87111 |
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| KILPATRICK TOWNSEND & STOCKTON LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 406 BLACKWELL STREET |
| SUITE 240 |
| DURHAM, NORTH CAROLINA 27701 |
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| PACIFIC WESTERN BANK |
| 406 BLACKWELL STREET |
| SUITE 240 |
| DURHAM, NC 27701 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 7401 SNAPROLL STREET, NE |
| ALBUQUERQUE, NEW MEXICO 87109 |
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| PACIFIC WESTERN BANK |
| 406 BLACKWELL STREET |
| SUITE 240 |
| DURHAM, NC 27701 |
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