Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/05/2018
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Application #:
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15002346
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Filing Dt:
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01/20/2016
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Publication #:
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Pub Dt:
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02/02/2017
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Inventors:
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Che-Wei Hsu, Shih-Ping Hsu, Pao-Hung Chou
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Title:
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PACKAGE SUBSTRATE WITH METAL ON CONDUCTIVE PORTIONS AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.458-17, XINXING RD. |
| HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 30353 |
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| CKC & PARTNERS CO., LTD. |
| 12TH FLOOR, RUTTONJEE HOUSE |
| 11 DUDDELL STREET |
| HONG KONG, HONG KONG |
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