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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/19/2018
Application #:
14110458
Filing Dt:
10/08/2013
Publication #:
Pub Dt:
01/30/2014
Inventors:
Tetsuro Nishimura, Kazuhiro Nogita, Stuart David McDonald, Jonathan James Read et al
Title:
SOLDER ALLOY
Assignment: 1
Reel/Frame:
032003/0151Recorded: 01/20/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/20/2013
Exec Dt:
09/20/2013
Exec Dt:
09/20/2013
Exec Dt:
10/01/2013
Exec Dt:
10/09/2013
Assignees:
16-15, ESAKA-CHO 1-CHOME
SUITA-SHI, OSAKA, JAPAN 5640063
ST. LUCIA
BRISBANE, AUSTRALIA QLD 4072
Correspondent:
STEFAN B. BLUM
10050 INNOVATION DRIVE
SUITE 400
DAYTON, OH 45342-4934

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