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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
12/26/2006
Application #:
UNAVAILABLE
Filing Dt:
09/22/2005
Inventor:
Kazuaki Higashibata
Title:
SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
014683/0095Recorded: 09/26/2003Pages: 15
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
05/29/2003
Assignee:
135 S. LASALLE STREET
CHICAGO, ILLINOIS 60603
Correspondent:
ARNSTEIN & LEHR
SCOTT KAPP
120 S. RIVERSIDE PLAZA
SUITE 1200
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
017022/0411Recorded: 09/22/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/25/2005
Assignee:
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI
KYOTO-FU 617-8555, JAPAN
Correspondent:
STEVEN I. WEISBURD
DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
1177 AVENUE OF THE AMERICA
41ST FLOOR
NEW YORK, NY 10036-2714
Assignment: 3
Reel/Frame:
056728/0307Recorded: 06/30/2021Pages: 10
Conveyance:
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, TRADEMARKS AND TRADENAMES
Assignor:
Exec Dt:
06/30/2021
Assignee:
10500 SEYMOUR AVENUE
FRANKLIN PARK, ILLINOIS 60131
Correspondent:
MOORE & VAN ALLEN PLLC
100 NORTH TRYON STREET
SUITE 4700, ATTN: IP DEPARTMENT
CHARLOTTE, NC 28202

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