Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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29558151
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Filing Dt:
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03/15/2016
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Inventor:
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Shing Hei Daniel CHEUNG
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Title:
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Electronic Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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57 TING KOK ROAD |
BLOCK 1, 23/F, TAI PING INDUSTRIAL CENTRE |
TAI PO, NEW TERRITORIES, HONG KONG |
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MCANDREWS, HELD & MALLOY, LTD. |
500 W. MADISON ST. |
34TH FLOOR |
CHICAGO, IL 60661 |
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