Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/22/2017
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Application #:
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29569239
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Filing Dt:
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06/24/2016
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Inventors:
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Kyoung Min KIM, Soo Kun JEON, Eun Hyun PARK
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Title:
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Mold For Packaging Semiconductor Light Emitting Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F, 49, WONGOMAE-RO 2BEON-GIL, GIHEUNG-GU, YONGIN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 446-901 |
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| HARNESS, DICKEY, & PIERCE, P.L.C |
| 7700 BONHOMME, SUITE 400 |
| ST. LOUIS, MO 63105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| B-15, 58, GIHEUNG-RO, GIHEUNG-GU |
| GYEONGGI-DO |
| YONGIN-SI, KOREA, REPUBLIC OF 16976 |
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| PNKIP LLC |
| 21937 BRAMBLEBUSH TER |
| BROADLANDS, VA 20148 |
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