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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/2019
Application #:
29639439
Filing Dt:
03/06/2018
Inventor:
Hideki SAWADA
Title:
POWER SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
046478/0233Recorded: 04/25/2018Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/07/2018
Assignee:
21, SAIIN MIZOSAKI-CHO, UKYO-KU
KYOTO-SHI, KYOTO, JAPAN 615-8585
Correspondent:
HAMRE, SCHUMANN, MUELLER & LARSON, P.C.
45 SOUTH SEVENTH STREET
SUITE 2700
MINNEAPOLIS, MN 55402

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