Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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29601165
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Filing Dt:
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04/19/2017
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Inventors:
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Satoru MURATA, Shinya MORITA, Masashi SUZUKI
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Title:
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SEALING MATERIAL RING FOR A SEMICONDUCTOR MANUFACTURING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 15-12, NISHI-SHIMBASHI 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8039 |
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| 6-2, IMAGO-CHO, YAMATOKORIYAMA-SHI |
| NARA, JAPAN 639-1031 |
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| FITCH, EVEN, TABIN & FLANNERY, LLP |
| 120 SOUTH LASALLE STREET, SUITE 1600 |
| CHICAGO, IL 60603-3406 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-4, KANDAKAJI-CHO |
| CHIYODA-KU |
| TOKYO, JAPAN 1010045 |
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| ALAN E. SCHIAVELLI |
| 1250 23RD STREET NW, SUITE 410 |
| WASHINGTON, DC 20037-1164 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6-2 IMAGO-CHO, YAMATOKORIYAMA-SHI |
| NARA, JAPAN |
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| HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
| 45 SOUTH SEVENTH STREET |
| SUITE 2700 |
| MINNEAPOLIS, MN 55402 |
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