Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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29712911
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Filing Dt:
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11/12/2019
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Inventors:
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Akira OKABE, Yukio TAKENAGA
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Title:
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SUPPORT FOR A WAFER FOR FABRICATING A SEMICONDUCTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 147-40, MASURAGAHARAMACHI |
| OHMURA-SHI |
| NAGASAKI, JAPAN 8560022 |
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| LEVINE BAGADE HAN LLP |
| 2400 GENG ROAD, SUITE 120 |
| PALO ALTO, CA 94303 |
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