Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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29745476
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Filing Dt:
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08/06/2020
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Inventor:
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Young Suk CHUNG
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Title:
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HEAT SINK FOR MEMORY MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SUITE 4006, 40/F CENTRAL PLAZA, 18 HARBOUR ROAD, WANCHAI |
HONG KONG, HONG KONG |
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SUGHRUE MION, PLLC |
2000 PENNSYLVANIA AVENUE, N.W. SUITE 900 |
WASHINGTON, DC 20006 |
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