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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/13/2023
Application #:
29789674
Filing Dt:
10/13/2021
Inventors:
Masayuki ARAKAWA, Junpei HOKARI, Akira KOJIMA, Masaki MIZUOCHI, Tomokazu KOBAYASHI et al
Title:
Apparatus for Evaluating Semiconductor Substrate
Assignment: 1
Reel/Frame:
058639/0525Recorded: 01/13/2022Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/17/2021
Exec Dt:
11/16/2021
Exec Dt:
12/06/2021
Exec Dt:
11/16/2021
Exec Dt:
12/06/2021
Exec Dt:
12/07/2021
Assignee:
17-1, TORANOMON 1-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
CROWELL & MORING LLP
1001 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20004

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