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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
11/20/2001
Application #:
09725679
Filing Dt:
11/30/2000
Publication #:
Pub Dt:
06/07/2001
Inventor:
Hidetoshi Sumitani
Title:
Semiconductor device manufacturing method and semiconductor wafer
Assignment: 1
Reel/Frame:
011323/0393Recorded: 11/30/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/21/2000
Assignee:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
FOLEY & LARDNER
DAVID A. BLUMENTHAL
WASHINGTON HARBOUR
3000 K STREET, N.W., SUITE 500
WASHINGTON, DC 20007-5109
Assignment: 2
Reel/Frame:
013758/0595Recorded: 02/06/2003Pages: 20
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/10/2003
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI, KANAGAWA 211-8668, JAPAN
Correspondent:
SURHRUE MION, PLLC
J. FRANK OSHA
2100 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20037
Assignment: 3
Reel/Frame:
014981/0119Recorded: 08/12/2004Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/26/2004
Exec Dt:
04/26/2004
Assignee:
2-1, YAESU 2-CHOME, CHUO-KU
TOKYO, JAPAN
Correspondent:
HOWARD L. BERNSTEIN
2100 PENNSYLVANIA AVE, NW
SUITE 800
WASHINGTON, DC 20037

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