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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/09/2002
Application #:
09742350
Filing Dt:
12/22/2000
Publication #:
Pub Dt:
06/28/2001
Inventor:
Takuya Sasaki
Title:
Paste to be fired for forming circuit board and method for preparing surface-modified silver powder
Assignment: 1
Reel/Frame:
011403/0253Recorded: 12/22/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/20/2000
Assignee:
1-1-1, OSAKI, SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
YOUNG & THOMPSON
RHONDA DESPER
SECOND FLOOR
745 SOUTH 23RD FLOOR
ARLINGTON, VA 22202
Assignment: 2
Reel/Frame:
012016/0174Recorded: 07/24/2001Pages: 3
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEES ADDRESS PREVIOUSLY RECORDED AT REEL 0253-0254
Assignor:
Exec Dt:
12/20/2000
Assignee:
1-11-1, OSAKI, SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
YOUNG & THOMPSON
MARGOT RUFF
SECOND FLOOR
745 SOUTH 23RD STREET
ARLINGTON, VA 22202

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