Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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04/26/2005
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Application #:
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09254118
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Filing Dt:
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05/19/1999
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Publication #:
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Pub Dt:
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08/09/2001
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Inventors:
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KOHEI TATSUMI, KENJI SHIMOKAWA, EIJI HASHINO
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Title:
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METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6-3, OTEMACHI 2-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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KENYON & KENYON |
EDWARD W. GREASON |
ONE BROADWAY |
NEW YORK, NY 11230 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-14-1, SOTOKANDA, CHIYODA-KU |
TOKYO, JAPAN 101-0021 |
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JOHN J. KELLY, JR. |
KENYON & KENYON LLP |
ONE BROADWAY |
NEW YORK, NEW YORK 10004 |
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Assignment:
3
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7-16-3, GINZA |
CHUO-KU |
TOKYO, JAPAN 104-0061 |
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PATRICK J. BIRDE |
1 BROADWAY |
KENYON & KENYON LLP |
NEW YORK, NY 10004 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-5-5, SHIMODERA |
NANIWA-KU, OSAKA-SHI |
OSAKA, JAPAN |
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PATRICK J BIRDE |
1 BROADWAY |
KENYON & KENYON LLP |
NEW YORK, NY 10004 |
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