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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09773663
Filing Dt:
02/02/2001
Publication #:
Pub Dt:
08/16/2001
Inventors:
Hideo Takahashi, Noboru Yamaguchi
Title:
Soldering method and soldering apparatus
Assignment: 1
Reel/Frame:
011518/0016Recorded: 02/02/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/10/2001
Exec Dt:
01/10/2001
Assignee:
MINATO-KU
1-4-28, MITA
TOKYO, JAPAN
Correspondent:
FINEGAN, HENDERSON, FARABOW, ET AL.
ERNEST F. CHAPMAN
1300 I STREET, N.W.
WASHINGTON, DC 20005-3315

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