Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09726588
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Filing Dt:
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12/01/2000
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Publication #:
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Pub Dt:
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09/06/2001
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Inventors:
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Hisayuki Abe, Toshihiko Taguchi, Yuji Kawamata, Akiko Iwano
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Title:
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THERMOSETTING SOLDERING FLUX AND SOLDERING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN |
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| 1-13-1 NIHONBASHI |
| CHUO-KU, TOKYO, JAPAN |
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| MICHAEL TOBIAS |
| 1730 K STREET, N.W. |
| SUITE 304 |
| WASHINGTON, D.C. 20006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDOCHO, ADACHI-KU |
| TOKYO, JAPAN |
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| BINGHAM MCCUTCHEN LLP |
| 2020 K STREET NW |
| WASHINGTON, DC 20006-1806 |
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