Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09752919
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Filing Dt:
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01/02/2001
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Publication #:
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Pub Dt:
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09/13/2001
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Inventors:
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Reinhard Stengl, Martin Franosch, Herbert Schafer, Hermann Wendt, Volker Lehmann et al
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Title:
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Integrated circuit configuration, method for producing it, and wafer including integrated circuit configurations
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ZT GG VM |
| POSTFACH 22 16 34 |
| MUNCHEN, GERMANY 80506 |
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| LERNER AND GREENBERG, P.A. |
| RALPH E. LOCHER |
| P.O. BOX 2480 |
| HOLLYWOOD, FL 33022 |
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