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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/22/2005
Application #:
09771700
Filing Dt:
01/30/2001
Publication #:
Pub Dt:
09/20/2001
Inventors:
Hiroshi Okamoto, Shin-ichi Inoue, Tetsuo Kanagawa, Masataka Sano, Hiroki Miyamatsu et al
Title:
FUNCTIONAL COMPOSITION, FUNCTIONAL RESIN COMPOSITION, AND FUNCTIONAL MOLDING
Assignment: 1
Reel/Frame:
011493/0051Recorded: 01/30/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/19/2000
Exec Dt:
01/19/2000
Exec Dt:
01/19/2000
Exec Dt:
01/19/2000
Exec Dt:
01/19/2000
Exec Dt:
01/19/2000
Assignee:
631, TERAJIMA-CHO, HAMAMATSU-SHI
SHIZUOKA 430-0925, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN ET AL
1725 K STREET, N.W., SUITE 1000
WASHINGTON, D.C. 20006
Assignment: 2
Reel/Frame:
011866/0453Recorded: 06/06/2001Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/19/2001
Exec Dt:
01/19/2001
Exec Dt:
01/19/2001
Exec Dt:
01/19/2001
Exec Dt:
01/19/2001
Exec Dt:
01/19/2001
Assignee:
HAMAMATSU-SHI,
631, TERAJIMA-CHO,
SHIZUOKA 430-0925,, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN ET AL.
1725 K ST., NW,
STE 1000
WASHINGTON, DC 20006

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