Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/10/2002
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Application #:
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09765204
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Filing Dt:
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01/18/2001
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Publication #:
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Pub Dt:
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10/11/2001
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Inventors:
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Takashi Nakamura, Kiyotaka Sawa, Akihiko Kobayashi, Katsutoshi Mine
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Title:
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ELECTRICALLY INSULATING THIN-FILM-FORMING RESIN COMPOSITION AND METHOD FOR FORMING THIN FILM THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1-3, MARUNOUCHI-CHIYODA-KU |
| 4TH FLOOR, AIG BUILDING |
| TOKYO 100-0005, JAPAN |
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| DOW CORNING CORPORATION |
| RICK D. STREU |
| INTELLECTUAL PROPERTY DEPT. -MAIL C01232 |
| 2200 W. SALZBURG ROAD, P.O. BOX 994 |
| MIDLAND, MI 48686-0994 |
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