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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6498055
Issue Dt:
12/24/2002
Application #:
09855529
Filing Dt:
05/16/2001
Publication #:
20010042913
Pub Dt:
11/22/2001
Inventors:
Masatoshi Fukuda, Susumu Harada, Tetsuya Sato, Hidenobu Sato, Atsushi Nakano
Title:
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RESIN MOLDING DIE, AND SEMICONDUCTOR MANUFACTURING SYSTEM
Assignment: 1
Reel/Frame:
011817/0551Recorded: 05/16/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FUKUDA, MASATOSHI
Exec Dt:
05/10/2001
HARADA, SUSUMU
Exec Dt:
05/10/2001
SATO, TETSUYA
Exec Dt:
05/10/2001
SATO, HIDENOBU
Exec Dt:
05/10/2001
NAKANO, ATSUSHI
Exec Dt:
05/10/2001
Assignee:
KABUSHIKI KAISHA TOSHIBA
72 HORIKAWA-CHO, SAIWA-KU
KAWASAKI-SHI, JAPAN
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT &
DUNNER, L.L.P.
MR. ERNEST F. CHAPMAN
1300 I STREET, N.W.
WASHINGTON, DC 20005-3315
Assignment: 2
Reel/Frame:
043709/0035Recorded: 08/24/2017Pages: 169
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
KABUSHIKI KAISHA TOSHIBA
Exec Dt:
07/06/2017
Assignee:
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME
MINATO-KU
TOKYO, JAPAN 105-0023
Correspondent:
OBLON, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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