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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/07/2003
Application #:
09866404
Filing Dt:
05/25/2001
Publication #:
Pub Dt:
12/06/2001
Inventor:
Takashi Miyazaki
Title:
FLIP CHIP TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTRUING THE SAME
Assignment: 1
Reel/Frame:
011854/0703Recorded: 05/25/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/22/2001
Assignee:
7-1, SHIBA 5-CHOME MINATO-KU
TOKYO, JAPAN
Correspondent:
HELFGOTT & KARAS, P.C.
SAMSON HELFGOTT
EMPIRE STATE BUILDING, 60TH FLOOR
NEW YORK, NEW YORK 10118
Assignment: 2
Reel/Frame:
013745/0188Recorded: 02/19/2003Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2002
Assignee:
1753 SHIMONUMABE
NAKAHARA-KU, KAWASAKI
KANAGAWA 211-8668, JAPAN
Correspondent:
KATTEN MUCHIN ZAVIS ROSENMAN
IP DEPARTMENT 15TH FL.
575 MADISON AVENUE
NEW YORK, NY 10022-2585

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