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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/23/2002
Application #:
09332325
Filing Dt:
06/14/1999
Publication #:
Pub Dt:
01/03/2002
Inventor:
MASASHI KAWAMURA
Title:
HEAT SINK AND MEMORY MODULE WITH HEAT SINK
Assignment: 1
Reel/Frame:
010036/0103Recorded: 06/14/1999Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/11/1999
Assignee:
7-1 SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
FOLEY, HOAG & ELIOT LLP
DONALD W. MUIRHEAD
PATENT GROUP
ONE POST OFFICE SQUARE
BOSTON, MA 02109-2170
Assignment: 2
Reel/Frame:
013746/0838Recorded: 02/12/2003Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/10/2003
Assignees:
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI
KANAGAWA 211-8668, JAPAN
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
CHOATE, HALL & STEWART
DONALD W. MUIRHEAD
53 STATE STREET, EXCHANGE PLACE
PATENT GROUP
BOSTON, MA 02109

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