Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/15/2003
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Application #:
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09841359
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Filing Dt:
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04/24/2001
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Publication #:
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Pub Dt:
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01/03/2002
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Inventors:
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Herbert De Pauw, Jan Vanfleteren, Suixin Zhang
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Title:
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LOW COST ELECTROLESS PLATING PROCESS FOR SINGLE CHIPS AND WAFER PARTS AND PRODUCTS OBTAINED THEREOF
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE |
| CHICAGO, IL 60606 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| B-3001 LEUVEN, BELGIUM |
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| ST. PIETERSNIEUWSTRAAT 25 |
| 9000 GENT, BELGIUM |
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| MCDONNELL, BOEHNEN, HULBERT ET AL |
| AMIR N. PENN |
| 300 SOUTH WACKER DRIVE - 32ND FLOOR |
| CHICAGO, ILLINOIS 60606 |
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