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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/15/2003
Application #:
09841359
Filing Dt:
04/24/2001
Publication #:
Pub Dt:
01/03/2002
Inventors:
Herbert De Pauw, Jan Vanfleteren, Suixin Zhang
Title:
LOW COST ELECTROLESS PLATING PROCESS FOR SINGLE CHIPS AND WAFER PARTS AND PRODUCTS OBTAINED THEREOF
Assignment: 1
Reel/Frame:
023148/0598Recorded: 08/27/2009Pages: 20
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/16/1984
Assignee:
KAPELDREEF 75
LEUVEN, BELGIUM 3001
Correspondent:
MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
300 SOUTH WACKER DRIVE
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
012095/0878Recorded: 08/20/2001Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/27/2001
Exec Dt:
07/30/2001
Exec Dt:
07/17/2001
Assignees:
KAPELDREEF 75
B-3001 LEUVEN, BELGIUM
ST. PIETERSNIEUWSTRAAT 25
9000 GENT, BELGIUM
Correspondent:
MCDONNELL, BOEHNEN, HULBERT ET AL
AMIR N. PENN
300 SOUTH WACKER DRIVE - 32ND FLOOR
CHICAGO, ILLINOIS 60606

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