Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/07/2002
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Application #:
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09211875
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Filing Dt:
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12/15/1998
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Publication #:
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Pub Dt:
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01/03/2002
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Inventors:
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TORU TAKISAWA, TAKAO YONEHARA, KENJI YAMAGATA
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Title:
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WAFER BONDING METHOD, APPARATUS AND VACUUM CHUCK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 30-2, SHIMOMARUKO 3-CHOME |
| OHTA-KU, TOKYO, JAPAN |
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| MORGAN & FINNEGAN, L.L.P. |
| MICHAEL M. MURRAY |
| 345 PARK AVENUE |
| NEW YORK, NY 10154 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CIMS 483-02-19 |
| 800 CHRYSLER DRIVE EAST |
| AUBURN HILLS, MICHIGAN 48326 |
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| LAWRENCE J. SHURUPOFF |
| DAIMLERCHRYSLER CORPORATION |
| CIMS 483-02-19 |
| 800 CHRYSLER DRIVE EAST |
| AUBURN HILLS, MI 48326-2757 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CIMS 483-02-19 |
| 800 CHRYSLER DRIVE EAST |
| AUBURN HILLS, MICHIGAN 48326 |
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| DAIMLERCHRYSLER CORPORATION |
| LAWRENCE J. SHURUPOFF |
| CIMS 483-02-19 |
| 800 CHRYSLER DRIVE EAST |
| AUBURN HILLS, MI 48326-2757 |
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