Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/29/2003
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Application #:
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09829441
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Filing Dt:
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04/10/2001
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Publication #:
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Pub Dt:
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01/10/2002
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Inventors:
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Hajime Saiki, Noritaka Miyamoto
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Title:
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PIN SOLDER JOINTED TO A RESIN SUBSTRATE, MADE HAVING A PREDETERMINED HARDNESS AND DIMENSIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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14-18, TAKATSUJI-CHO, MIZUHO-KU |
NAGOYA-SHI, AICHI, JAPAN |
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MORGAN, LEWIS & BOCKIUS LLP |
ROBERT J. GAYBRICK |
1800 M STREET, N.W. |
WASHINGTON, D.C. 20036 |
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