Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09741239
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Filing Dt:
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12/19/2000
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Publication #:
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Pub Dt:
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01/31/2002
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Inventors:
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Chung-Chen Wu, Ming-Tzu Chen
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Title:
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Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 31-1, SHIEN PAN RD., KUEI SAN INDUSTRIAL ZONE |
| TAOYUAN HSIEN, TAIWAN R.O.C |
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| SKJERVEN MORRILL MACPHERSON LLP |
| ALAN H. MACPHERSON |
| 25 METRO DRIVE, SUITE 700 |
| SAN JOSE, CA 95110 |
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