Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09791674
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Filing Dt:
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02/26/2001
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Publication #:
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Pub Dt:
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01/31/2002
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Inventor:
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Peter R. Ewer
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Title:
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Solder composition for high temperature semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 233 KANSAS STREET |
| EL SEGUNDO, CALIFORNIA 90245 |
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| OSTROLENK, FABER, GERB & SOFFEN, LLP |
| STEPHEN A. SOFFEN |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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