Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/25/2002
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Application #:
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09930022
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Filing Dt:
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08/14/2001
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Publication #:
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Pub Dt:
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02/07/2002
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Inventors:
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Guy T. Blalock, Brian F. Gordon, Hugh E. Stroupe
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Title:
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WAFER PLANARIZATION USING A UNIFORM LAYER OF MATERIAL AND METHOD AND APPARATUS FOR FORMING UNIFORM LAYER OF MATERIAL USED IN SEMICONDUCTOR PROCESSING
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED AT REEL 010332 FRAME 0739.
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83706 |
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| KLARQUIST SPARKMAN, LLP |
| JEFFREY B. HAENDLER, ESQ. |
| 121 S.W. SALMON STREET |
| ONE WORLD TRADE CENTER, SUITE 1600 |
| PORTLAND, OREGON 97204-2988 |
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