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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
Application #:
09893160
Filing Dt:
06/27/2001
Publication #:
Pub Dt:
02/07/2002
Inventor:
Gerald Friese
Title:
POWER PADS FOR APPLICATION OF HIGH CURRENT PER BOND PAD IN SILICON TECHNOLOGY
Assignment: 1
Reel/Frame:
012187/0997Recorded: 09/24/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/17/2001
Assignee:
1730 NORTH FIRST STREET
SAN JOSE, CALIFORNIA 95112
Correspondent:
SIEMENS CORPORATION
ELSA KELLER
INTELLECTUAL PROPERTY DEPARTMENT
186 WOOD AVENUE SOUTH
ISELIN, NJ 08830
Assignment: 2
Reel/Frame:
013443/0816Recorded: 02/24/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/24/2003
Assignee:
ST. MARTIN-STR. 53
81541 MUNICH, GERMANY
Correspondent:
SIEMENS CORPORATION
ELSA KELLER
INTELLECTUAL PROPERTY DEPARTMENT
186 WOOD AVENUE SOUTH
ISELIN, NJ 08830

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