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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/22/2003
Application #:
09945964
Filing Dt:
09/04/2001
Publication #:
Pub Dt:
03/07/2002
Inventors:
Tamotsu Kitamura, Takayuki Nagasaki
Title:
AUTOMATIC WIRING METHOD FOR SEMICONDUCTOR PACKAGE ENABLING DESIGN OF HIGH-SPEED WIRING FOR SEMICONDUCTOR PACKAGE WITH REDUCED LABOR
Assignment: 1
Reel/Frame:
012160/0174Recorded: 09/04/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/15/2001
Exec Dt:
06/05/2001
Assignee:
711, AZA SHARIDEN, OAZA KURITA, NAGANO-SHI
NAGANO 380-0921, JAPAN
Correspondent:
PAUL & PAUL
JOHN F. MCNULTY, ESQ.
2900 TWO THOUSAND MARKET STREET
PHILADELPHIA, PA 19103

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