Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/20/2004
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Application #:
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09840864
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Filing Dt:
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04/25/2001
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Publication #:
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Pub Dt:
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03/14/2002
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Inventors:
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Yasukazu Nakata, Yuichi Iwakata, Takeshi Kondo, Hideo Senoo
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Title:
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REINFORCEMENT MATERIAL FOR SILICON WAFER AND PROCESS FOR PRODUCING IC CHIP USING SAID MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO 173-0001, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW, ET AL |
| ERNEST F. CHAPMAN |
| 1300 I STREET, N.W. |
| WASHINGTON, D.C. 20005-3315 |
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