Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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09254119
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Filing Dt:
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04/16/1999
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Publication #:
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Pub Dt:
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03/28/2002
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Inventors:
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KOHEI TATSUMI, KENJI SHIMOKAWA, EIJI HASHINO
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Title:
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SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-3, OTEMACHI 2-CHOME, |
| SHIYODA-KU TOKYO, JAPAN |
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| KEYNON & KEYNON |
| EDWARD W. GREASON |
| ONE BROADWAY |
| NEW YORK N.Y. 10004 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-14-1, SOTOKANDA |
| CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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| JOHN J.KELLY, JR. |
| KENYON & KENYON LLP |
| ONE BROADWAY |
| NEW YORK, NEW YORK 10004 |
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Assignment:
3
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| 7-16-3, GINZA |
| CHUO-KU |
| TOKYO, JAPAN 104-0061 |
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| PATRICK J BIRDE |
| 1 BROADWAY |
| KENYON & KENYON LLP |
| NEW YORK, NY 10004 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-5-5, SHIMODERA |
| NANIWA-KU, OSAKA-SHI |
| OSAKA, JAPAN |
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| PATRICK J BIRDE |
| 1 BROADWAY |
| KENYON & KENYON LLP |
| NEW YORK, NY 10004 |
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