Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/10/2002
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Application #:
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09952303
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Filing Dt:
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09/12/2001
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Publication #:
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Pub Dt:
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04/04/2002
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Inventors:
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Seong-Chan Han, Dong-Woo Shin, Dong-Chun Lee, Wang-Jae Lee
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Title:
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HEAT SINK PROVIDED WITH COUPLING MEANS, MEMORY MODULE ATTACHED WITH THE HEAT SINK AND MAUNFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, PALDAL-KU, |
| SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, PC |
| ALAN T. MCCOLLOM |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OREGON 97205 |
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