Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/16/2003
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Application #:
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09972851
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Filing Dt:
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10/10/2001
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Publication #:
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Pub Dt:
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04/11/2002
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Inventors:
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Shinichi Tomita, Shuhei Tsuda, Yasunobu Ikeda
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Title:
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METHOD FOR BONDING SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 5-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA 541-0041, JAPAN |
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| KANESAKA & TAKEUCHI |
| YUSUKE TAKEUCHI |
| 1423 POWHATAN STREET |
| ALEXANRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2-1 SHIBAURA, MINATO-KU |
| TOKYO 105-8634, JAPAN |
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| ARMSTRONG, WESTERMAN & HATTORI, LLP |
| DONALD W. HANSON |
| STE. 1000 |
| 1725 K STREET, N.W. |
| WASHINGTON, DC 20006 |
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