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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
6440228
Issue Dt:
08/27/2002
Application #:
09774011
Filing Dt:
01/31/2001
Publication #:
20020050305
Pub Dt:
05/02/2002
Inventors:
Toshihiko Taguchi, Kunihito Takaura, Takashi Nagashima, Masahiko Hirata et al
Title:
LEAD-FREE ZINC-CONTAINING SOLDER PASTE
Assignment: 1
Reel/Frame:
011866/0689Recorded: 06/05/2001Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TAGUCHI, TOSHIHIKO
Exec Dt:
05/11/2001
TAKAURA, KUNIHITO
Exec Dt:
05/14/2001
HIRATA, MASAHIKO
Exec Dt:
05/15/2001
YOSHIDA, HISAHIKO
Exec Dt:
05/15/2001
NAGASHIMA, TAKASHI
Exec Dt:
05/15/2001
Assignees:
SENJU METAL INDUSTRY CO., LTD.
23 SENJU-HASHIDO-CHO ADACHI-KU,
TOKYO, JAPAN
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA KADOMA-SHI,
OSAKA,, JAPAN
Correspondent:
MICHAEL TOBIAS
1730 K STREET N.W.
SUITE 304
WASHINGTON, D.C. 20006

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