Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09906068
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Filing Dt:
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07/17/2001
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Publication #:
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Pub Dt:
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05/09/2002
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Inventors:
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Kazuhisa Endo, Nobuyuki Nakajima, Noriaki Saitou
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Title:
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Epoxy resin composition for encapsulating semiconductor, and resin-encapsulated type semiconductor apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME |
| CHUO-KU, OSAKA, JAPAN |
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| SUGHRUE, MION, PLLC |
| J. FRANK OSHA, ESQ. |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20037-3213 |
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Assignment:
2
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RERECORD TO CORRECT THE THIRD INVENTOR TO READ--SAITOU--AT REEL 012282 FRAME 0828
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| 5-33, KITAHAMA 4-CHOME |
| CHUO-KU, OSAKA, JAPAN |
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| SUGHRUE MION, PLLC |
| J. FRANK OSHA |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20037-3213 |
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