Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09944344
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Filing Dt:
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09/04/2001
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Publication #:
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Pub Dt:
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05/09/2002
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Inventors:
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Shiroshi Matsuki, Kazunori Akiyama
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Title:
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Material for copper electroplating, method for manufacturing same and copper electroplating method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7, SUCHIRO-CHO, TSURUMI-KU YOKOHAMA-SHI |
| KANAGAWA-KEN, JAPAN |
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| MCDERMOTT, WILL & EMERY |
| CAMERON K. WEIFFENBACH |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005 |
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