Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09834629
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Filing Dt:
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04/16/2001
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Publication #:
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Pub Dt:
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05/16/2002
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Inventors:
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Wen Lo Shieh, Huang Fu-Yu, Tu Feng Chang, Yung-Cheng Chuang
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Title:
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Application of wire bonding technology on wafer bump, wafer level chip scale package structure and the method of manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12-2 NEI HUAN SOUTH ROAD, N.E.P.Z. |
| KAOHSIUNG CITY, TAIWAN |
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| WEN LO SHIEH |
| PO BOX 82-144 |
| TAIPEI, TAIWAN |
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