Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10010169
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Filing Dt:
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11/13/2001
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Publication #:
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Pub Dt:
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05/16/2002
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Inventors:
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Richard L. Segar, Jumna P. Ramdular, Paul E. Gallup, John A. Rice, Richard P. Larson et al
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Title:
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HGA ballbond assembly with wafer process assembly features
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 920 DISC DRIVE |
| SCOTTS VALLEY, CALIFORNIA 95066 |
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| KINNEY & LANGE, P.A. |
| DAVID R. FAIRBAIM |
| 312 SOUTH THIRD STREET |
| MINNEAPOLIS, MN 55415-1002 |
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Assignment:
2
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| 270 PARK AVENUE |
| NEW YORK, NEW YORK 10017 |
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| FEDERAL RESEARCH CORPORATION |
| PENELOPE AGODOA |
| SUITE 101 |
| 400 SEVENTH ST., NW |
| WASHINGTON, DC 20004 |
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Assignment:
3
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RELEASE OF SECURITY INTERESTS IN PATENT RIGHTS
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| 920 DISC DRIVE |
| SCOTTS VALLEY, CALIFORNIA 95066 |
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| KIRSTIE HOWARD, ESQ. |
| SIMPSON THACHER & BARTLETT LLP |
| 425 LEXINGTON AVENUE |
| NEW YORK, NY 10017 |
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