Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
09951913
|
Filing Dt:
|
09/13/2001
|
|
Publication #:
|
|
Pub Dt:
|
05/16/2002
| | | | |
|
Inventors:
|
Le Ling, Akira Sugawara
|
|
Title:
|
Copper alloys for use as connector materials having high resistance to stress corrosion cracking and a process for producing the same
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
|
|
|
|
| FRISHAUF, HOLTZ, GOODMAN, ET AL. |
| HERBERT GOODMAN |
| 767 THIRD AVENUE, 25TH FLOOR |
| NEW YORK, NY 10017-2023 |
|
|
Search Results as of:
05/06/2024 03:46 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
