Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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09987109
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Filing Dt:
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11/13/2001
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Publication #:
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Pub Dt:
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05/23/2002
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Inventors:
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Kazuki Honma, Terutaka Okada, Fumiaki Kitajima, Takahiro Hatazawa, Hiroyuki Motomatsu et al
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Title:
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SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, KANDA SURUGADAI 4-CHOME |
| CHIYODA-KU TOKYO, JAPAN |
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| TENNOCHO, MINAMIAKITA-GUN |
| 64, TENNO AZANAGANUMA |
| AKITA, JAPAN |
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| MILES & STOCKBRIDGE P.C. |
| MITCHELL W. SHAPIRO |
| 1751 PINNACLE DRIVE |
| SUITE 500 |
| MCLEAN, VA 22102-3833 |
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